HN

Hiromi Nishiyawa

HM Hitachi Via Mechanics: 2 patents #20 of 109Top 20%
Overall (All Time): #2,097,032 of 4,157,543Top 55%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
8278594 Method and apparatus for perforating printed circuit board Kunio Arai, Hiroyuki Sugawara, Hiroaki Ashizawa 2012-10-02
7531767 Method and apparatus for laser perforating printed circuit board Kunio Arai, Hiroyuki Sugawara, Hiroaki Ashizawa 2009-05-12