Issued Patents All Time
Showing 26–30 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4546168 | Thermosetting resin composition comprising (1) dicyanamide, (2) polyvalent imide and (3) polymerizable compound | Akio Takahashi, Motoyo Wajima, Hirosada Morishita | 1985-10-08 |
| 4526835 | Multi-layer printed circuit board and process for production thereof | Akio Takahashi, Motoyo Wajima, Hirosada Morishita | 1985-07-02 |
| 4482703 | Thermosetting resin composition comprising dicyanamide and polyvalent imide | Akio Takahashi, Motoyo Wajima, Hirosada Morishita | 1984-11-13 |
| 4400438 | Process for producing fire retardant and heat resistant copper-clad laminated board, and varnish therefor | Akio Takahashi, Yutaka Itoh, Motoyo Wajima, Hirosada Morishita, Yutaka Mizuno +2 more | 1983-08-23 |
| 4346206 | Imide prepolymer from reaction of epoxy compound with bis-imide/diamine reaction mixture | Akio Takahashi, Yutaka Itoh, Motoyo Wajima, Hirosada Morishita, Yutaka Mizuno +2 more | 1982-08-24 |