Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8953406 | Semiconductor module includes semiconductor chip initialized by reset signal | Yoji Nishio, Susumu Hatano, Haruki Nagahashi, Masashi Kawamura, Tadaaki Yoshimura | 2015-02-10 |
| 7071243 | Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film | Kuniaki Sato, Hiroaki Hirakura, Toshihiko Ito, Toshizumi Yoshino | 2006-07-04 |
| 7049036 | Photosensitive resin composition, photosensitive element using the same, method for producing resist pattern, resist pattern and substrate having the resist pattern laminated thereon | Kuniaki Satou, Takahiko Kutsuna, Toshizumi Yoshino, Mikio Uzawa | 2006-05-23 |
| 6692793 | Photo-cured film, and photosensitive element, printed wiring board and semiconductor package using such film | Kuniaki Sato, Hiroaki Hirakura, Toshihiko Ito, Toshizumi Yoshino | 2004-02-17 |
| 6583198 | Photo curable resin composition and photosensitive element | Kuniaki Sato, Hiroaki Hirakura, Toshihiko Ito, Toshizumi Yoshino | 2003-06-24 |
| 6238840 | Photosensitive resin composition | Kuniaki Sato, Toshihiko Ito, Toshizumi Yoshino, Hiroaki Hirakura | 2001-05-29 |
| 6100768 | Ring oscillator generating pulse signal at constant pulse period under unstable power voltage | — | 2000-08-08 |
| 6060215 | Photosensitive resin composition and application of its photosensitivity | Jin Amanokura, Fumihiko Ota, Ritsuko Obata, Toshihiko Akahori, Kenji Suzuki +3 more | 2000-05-09 |
| 5885723 | Bonding film for printed circuit boards | Atsushi Takahashi, Shinji Ogi, Koji Morita, Kazunori Yamamoto, Ken Nanaumi +4 more | 1999-03-23 |
| 5166288 | Coating composition for coating metal plate | Hiroshi Kanai, Joji Oka, Tsuneo Tanuma | 1992-11-24 |
| 4309330 | Copolymer emulsion | Ryoji Ukita | 1982-01-05 |
| 4301048 | Water-dispersed resin composition | Minoru Fujishima, Hisasi Kaneko, Shigeyoshi Tanaka | 1981-11-17 |