Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10947326 | Adhesive composition, cured article, semiconductor device, and production method for same | Sadaaki Katou, Takuya KOMINE | 2021-03-16 |
| 10808150 | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | Sadaaki KATO, Mika Kimura, Aya IKEDA | 2020-10-20 |
| 10358580 | Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element | Aya IKEDA, Sadaaki Katou, Syougo Kikuchi, Shu Hashimoto | 2019-07-23 |
| 9920227 | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | Sadaaki Katou, Mika Kimura, Aya IKEDA | 2018-03-20 |
| 9868884 | Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element | Aya IKEDA, Sadaaki Katou, Syougo Kikuchi, Shu Hashimoto | 2018-01-16 |