Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10808150 | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | Sadaaki KATO, Mika Kimura, Shinjiro Fujii | 2020-10-20 |
| 10358580 | Adhesive composition, resin cured product obtained from adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element | Shinjiro Fujii, Sadaaki Katou, Syougo Kikuchi, Shu Hashimoto | 2019-07-23 |
| 9920227 | Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging element | Sadaaki Katou, Mika Kimura, Shinjiro Fujii | 2018-03-20 |
| 9868884 | Adhesive composition, method for manufacturing semiconductor device using adhesive composition, and solid-state imaging element | Sadaaki Katou, Shinjiro Fujii, Syougo Kikuchi, Shu Hashimoto | 2018-01-16 |