Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7842397 | Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil | Yasuyuki Ito, Katsuyuki Matsumoto, Koji Nukaga, Yasuhiro Kusano, Kenji Yokomizo +2 more | 2010-11-30 |
| 7789977 | Rolled copper foil and manufacturing method thereof | Takemi Muroga, Yasuyuki Ito, Koji Aoyagi, Yoshiki Yamamoto, Kenji Yokomizo | 2010-09-07 |
| 7763393 | Fuel cell having electrode channel member with comb-teeth shape | Kazuhiko Nakagawa, Masahiro Seido, Mineo Washima, Takaaki Sasaoka, Kunihiro Fukuda | 2010-07-27 |
| 7703503 | Heat pipe heat exchanger and method of fabricating the same | Hitoshi Sakayori, Tooru Kurosawa, Hironori Kitajima | 2010-04-27 |
| 7631828 | Level wound coil, method of manufacturing same, and package for same | Ken Horiguchi, Yusuke Takenaga, Mamoru Hofuku, Kenichi Inui, Tomo Kawano | 2009-12-15 |
| 7594621 | Level wound coil, method of manufacturing same, and package for same | Kenichi Inui, Yusuke Takenaga, Tomo Kawano, Mamoru Houfuku, Ken Horiguchi | 2009-09-29 |
| 7549601 | Level wound coil mounted on pallet, and package for same | Ken Horiguchi, Yusuke Takenaga, Mamoru Hofuku, Kenichi Inui, Tomo Kawano | 2009-06-23 |
| 7537177 | Level wound coil, method of manufacturing same, and package for same | Ken Horiguchi, Yusuke Takenaga, Mamoru Hofuku, Kenichi Inui, Tomo Kawano | 2009-05-26 |
| 7344785 | Copper foil for printed circuit board, method for fabricating same, and trivalent chromium conversion treatment solution used for fabricating same | Muneo Kodaira, Shingo Watanabe, Gen Sasaki, Yasuyuki Ito | 2008-03-18 |
| 7141823 | Thin film transistor semiconductor device | Takashi Hamada, Hidekazu Miyairi, Takuya Matsuo, Naoki Makita | 2006-11-28 |
| 7108923 | Copper foil for printed circuit board with taking environmental conservation into consideration | Yasuyuki Ito, Katsuyuki Matsumoto, Kenji Yokomizo, Yasuhiro Kusano, Shinichiro Shimizu +1 more | 2006-09-19 |
| 7015079 | Semiconductor film, semiconductor device, and method of manufacturing the same including adding metallic element to the amorphous semiconductor film and introducing oxygen after crystallization | Hidekazu Miyairi, Aiko Shiga, Naoki Makita, Takuya Matsuo | 2006-03-21 |
| 6777713 | Irregular semiconductor film, having ridges of convex portion | Hidekazu Miyairi, Aiko Shiga, Naoki Makita, Takuya Matsuo | 2004-08-17 |
| 6142307 | Packing system of electronic components | Masao Ukita, Yoshio Mikami | 2000-11-07 |
| 5821562 | Semiconductor device formed within asymetrically-shaped seed crystal region | Naoki Makita, Takashi Funai, Yoshitaka Yamamoto, Yasuhiro Mitani, Tadayoshi Miyamoto +1 more | 1998-10-13 |
| 5696003 | Method for fabricating a semiconductor device using a catalyst introduction region | Naoki Makita, Takashi Funai, Yoshitaka Yamamoto, Yasuhiro Mitani, Tadayoshi Miyamoto +1 more | 1997-12-09 |
| 5677749 | Method for producing an LCD having no spacers in the display area in which heating alleviates cell distortion or greater pressure is applied to the seal region | Koujiro Tsubota, Kazuyoshi Fujioka, Yohji Yoshimura, Hiroyuki Ohgami, Yutaka Takafuji +2 more | 1997-10-14 |
| 5629787 | Method for producing an LCD by pressing the substrates | Koujiro Tsubota, Kazuyoshi Fujioka, Yohji Yoshimura, Hiroyuki Ohgami, Yutaka Takafuji +2 more | 1997-05-13 |
| 5499127 | Liquid crystal display device having a larger gap between the substrates in the display area than in the sealant area | Koujiro Tsubota, Kazuyohsi Fujioka, Yohji Yoshimura, Hiroyuki Ohgami, Yutaka Takafuji +2 more | 1996-03-12 |
| 4330778 | Device for detecting broken filaments in lamps | Kazuo Yamazaki, Osafumi Takemoto | 1982-05-18 |