YK

Yousuke Kawahito

HI Hirotec: 1 patents #7 of 40Top 20%
OU Osaka University: 1 patents #681 of 1,984Top 35%
📍 Suita, JP: #751 of 1,253 inventorsTop 60%
Overall (All Time): #2,809,219 of 4,157,543Top 70%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
10744719 Method for bonding metal and resin and metal resin bonded body Kiminori Washika 2020-08-18