KW

Kiminori Washika

HI Hirotec: 2 patents #1 of 40Top 3%
OU Osaka University: 1 patents #681 of 1,984Top 35%
Overall (All Time): #1,827,878 of 4,157,543Top 45%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
11826964 Method of bonding thermoplastic resin and metal Tatsumi Kawafuchi 2023-11-28
10744719 Method for bonding metal and resin and metal resin bonded body Yousuke Kawahito 2020-08-18