Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12317462 | Electronic package and method of manufacturing the same | Chen-Yu Wang, Huan-Kuen Chen | 2025-05-27 |
| 10777525 | Filp chip package | Wen-Chieh Tu | 2020-09-15 |
| 9105613 | Method of manufacturing electronic package module and electronic package module manufactured by the same | Jenchun Chen, Shih-Chien Chen | 2015-08-11 |
| 8674503 | Circuit board, fabricating method thereof and package structure | Chia-Hui Wu | 2014-03-18 |
| 7906374 | COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereof | Chiu-Shun Lin | 2011-03-15 |
| 7473459 | Method of manufacturing a film printed circuit board | Chia-Hui Wu, Hung-Yi Wang | 2009-01-06 |
| 7064449 | Bonding pad and chip structure | Chiu-Shun Lin, Kuan-Chou Lin, Chia-Hui Wu | 2006-06-20 |
| 7061078 | Semiconductor package | — | 2006-06-13 |