Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10128348 | Metal bump structure for use in driver IC and method for forming the same | — | 2018-11-13 |
| 9450061 | Metal bump structure for use in driver IC and method for forming the same | — | 2016-09-20 |
| 8618678 | Chip structure and chip package structure | — | 2013-12-31 |
| 7906374 | COF packaging structure, method of manufacturing the COF packaging structure, and method for assembling a driver IC and the COF packaging structure thereof | Pai-Sheng Cheng | 2011-03-15 |
| 7449770 | Substrate with slot | Po-Chiang Tseng, Chen-Li Wang, Chia-Ying Lee | 2008-11-11 |
| 7064449 | Bonding pad and chip structure | Kuan-Chou Lin, Chia-Hui Wu, Pai-Sheng Cheng | 2006-06-20 |