Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12482785 | Trim free wafer bonding methods and devices | Shun-Yuan Ju, I-Hsun Huang, Kuo-Ling Chiang, Chien Ju Wang | 2025-11-25 |
| 7105752 | Method and apparatus for avoiding pressing inaccuracies on a touch panel | Jung-Yuan Tsai, Wan-Ting Tsai | 2006-09-12 |