Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12344739 | Conductive epoxy resin composition for copper bonding | Wei Yao, Qili Wu, Jiawen Zhao | 2025-07-01 |
| 12051522 | Silver sintering composition containing copper alloy for metal bonding | Wei Yao, Jaiwen Zhao, Qili Wu | 2024-07-30 |