Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12344739 | Conductive epoxy resin composition for copper bonding | Yang Ti, Qili Wu, Jiawen Zhao | 2025-07-01 |
| 12051522 | Silver sintering composition containing copper alloy for metal bonding | Yang Ti, Jaiwen Zhao, Qili Wu | 2024-07-30 |
| 10287444 | EMI shielding composition and process for applying it | Wangsheng Fang | 2019-05-14 |
| 9796898 | Single crystal alumina filled die attach paste | Long Fang, Wangsheng Fang | 2017-10-24 |
| 7718742 | Industrial syntheses process of high tran-1, 4-polyisoprene | Baochen Huang, Zhichao Zhao, Aihua Du, Yongxian Zhao | 2010-05-18 |
| 7215522 | Power module of field emission display and method of power generation thereof | Chi-Hao Wo, Jia-Hung Wu, Kuei-Wen Cheng | 2007-05-08 |