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Michael Bourbina

HS Hemlock Semiconductor: 2 patents #8 of 50Top 20%
Dow Corning: 1 patents #971 of 1,768Top 55%
Overall (All Time): #1,518,995 of 4,157,543Top 40%
3
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9029269 Wafer bonding system and method for bonding and debonding thereof Jeffrey Nicholas Bremmer, Eric Scott Moyer, Sheng Wang, Craig Rollin Yeakle 2015-05-12
5361128 Method for analyzing irregular shaped chunked silicon for contaminates Lydia L. Hwang, Joaquin Enrique Luna, Scott A. Wheelock 1994-11-01
5108720 Float zone processing of particulate silicon James R. McCormick, Scott A. Wheelock 1992-04-28