Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9029269 | Wafer bonding system and method for bonding and debonding thereof | Michael Bourbina, Eric Scott Moyer, Sheng Wang, Craig Rollin Yeakle | 2015-05-12 |
| 6210749 | Thermally stable dielectric coatings | Kyuha Chung, Chandan Kumar Saha, Michael John Spaulding | 2001-04-03 |
| 6022625 | Method for producing thick crack-free coatings from hydrogen silsesquioxane resin | Kyuha Chung, Chandan Kumar Saha, Michael John Spaulding | 2000-02-08 |
| 5906859 | Method for producing low dielectric coatings from hydrogen silsequioxane resin | Youfan Liu | 1999-05-25 |
| 5866197 | Method for producing thick crack-free coating from hydrogen silsequioxane resin | Kyuha Chung, Chandan Kumar Saha, Michael John Spaulding | 1999-02-02 |
| 5707681 | Method of producing coatings on electronic substrates | Youfan Liu | 1998-01-13 |
| 5628950 | Method and apparatus for producing multilayer plastic articles | Walter J. Schrenk, Ranganath K. Shastri, Herbert C. Roehrs, Ralph E. Ayres, Mark A. Barger | 1997-05-13 |
| 5380479 | Method and apparatus for producing multilayer plastic articles | Walter J. Schrenk, Herbert C. Roehrs, Ranganath K. Shastri, Ralph E. Ayres, Mark A. Barger | 1995-01-10 |