Issued Patents All Time
Showing 201–225 of 437 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8482879 | Magnetic head for perpendicular magnetic recording having a return path section | Yoshitaka Sasaki, Kazuki Sato, Shigeki Tanemura, Hironori Araki, Tatsuya Shimizu | 2013-07-09 |
| 8482105 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same | Yoshitaka Sasaki, Atsushi Iijima | 2013-07-09 |
| 8477452 | Magnetic head for perpendicular magnetic recording having a tapered main pole | Yoshitaka Sasaki, Kazuki Sato, Shigeki Tanemura, Hironori Araki, Atsushi Iijima | 2013-07-02 |
| 8468866 | Die cushion device | Takuji Miyasaka, Hirohide Sato, Ryota Yoshimura, Masaya Nakagawa, Eiji Doba +1 more | 2013-06-25 |
| 8466562 | Layered chip package | Yoshitaka Sasaki, Hiroshi Ikejima, Atsushi Iijima | 2013-06-18 |
| 8465658 | Method of forming main pole of thermally-assisted magnetic recording head | Hironori Araki, Yoshitaka Sasaki, Kazuki Sato, Shigeki Tanemura, Yukinori Ikegawa | 2013-06-18 |
| 8459786 | Liquid ejecting apparatus for eliminating and suppressing generation of air bubbles | — | 2013-06-11 |
| 8461050 | Taper-etching method and method of manufacturing near-field light generator | Hironori Araki, Yoshitaka Sasaki, Kazuki Sato, Shigeki Tanemura, Yukinori Ikegawa | 2013-06-11 |
| 8454848 | Method of manufacturing plasmon generator | Yoshitaka Sasaki, Shigeki Tanemura, Hironori Araki, Kazuki Sato, Kazumasa Yasuda | 2013-06-04 |
| 8455349 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Atsushi Iijima, Tatsuya Harada | 2013-06-04 |
| 8456968 | Thermally-assisted magnetic recording head having dual heat sink layers | Yoshitaka Sasaki, Hironori Araki, Shigeki Tanemura, Kazumasa Yasuda, Ryuji Fujii | 2013-06-04 |
| 8449053 | Liquid ejecting apparatus and liquid charging method | Hitotoshi Kimura | 2013-05-28 |
| 8446385 | Electronic device having touch panel and operating control method | — | 2013-05-21 |
| 8441112 | Method of manufacturing layered chip package | Yoshitaka Sasaki, Hiroshi Ikejima, Atsushi Iijima | 2013-05-14 |
| 8441755 | Magnetic head for perpendicular magnetic recording having a main pole, a shield and a coil core part setback away from the medium facing surface a specified distance | Yoshitaka Sasaki, Kazuki Sato, Atsushi Iijima | 2013-05-14 |
| 8427781 | Magnetic head for perpendicular magnetic recording having a main pole and a shield | Yoshitaka Sasaki, Kazuki Sato, Hironori Araki, Shigeki Tanemura, Tatsuya Shimizu | 2013-04-23 |
| 8426981 | Composite layered chip package | Yoshitaka Sasaki, Atsushi Iijima | 2013-04-23 |
| 8426979 | Composite layered chip package | Yoshitaka Sasaki, Hiroshi Ikejima, Atsushi Iijima | 2013-04-23 |
| 8426948 | Laminated semiconductor wafer, laminated chip package and method of manufacturing the same | Yoshitaka Sasaki, Atsushi Iijima | 2013-04-23 |
| 8426947 | Laminated semiconductor wafer, laminated chip package and method of manufacturing the same | Yoshitaka Sasaki, Atsushi Iijima | 2013-04-23 |
| 8426946 | Laminated semiconductor substrate, laminated chip package and method of manufacturing the same | Yoshitaka Sasaki, Atsushi Iijima | 2013-04-23 |
| 8422166 | Magnetic head for perpendicular magnetic recording having a main pole and a shield | Yoshitaka Sasaki, Kazuki Sato, Shigeki Tanemura, Hironori Araki, Tatsuya Shimizu | 2013-04-16 |
| 8421243 | Layered chip package and method of manufacturing same | Yoshitaka Sasaki, Hiroshi Ikejima, Atsushi Iijima | 2013-04-16 |
| 8416528 | Magnetic head for perpendicular magnetic recording having a return path section | Yoshitaka Sasaki, Shigeki Tanemura, Kazuki Sato, Yukinori Ikegawa, Atsushi Iijima +1 more | 2013-04-09 |
| 8406089 | Heat-assisted magnetic recording head with laser diode fixed to slider | Yoshitaka Sasaki, Shigeki Tanemura, Hironori Araki | 2013-03-26 |