Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8627887 | In situ recovery from a hydrocarbon containing formation | Harold J. Vinegar, Meliha Deniz Sumnu-Dindoruk, Scott Lee Wellington, Kevin Albert Maher, John Michael Karanikas +3 more | 2014-01-14 |
| 7066254 | In situ thermal processing of a tar sands formation | Harold J. Vinegar, Eric Pierre de Rouffignac, John Michael Karanikas, Kevin Albert Maher, Meliha Deniz Sumnu-Dindoruk +3 more | 2006-06-27 |
| 7055600 | In situ thermal recovery from a relatively permeable formation with controlled production rate | Margaret Ann Messier, Steven Dexter Crane, Eric Pierre de Rouffignac, John Michael Karanikas, Kevin Albert Maher +3 more | 2006-06-06 |
| 6981548 | In situ thermal recovery from a relatively permeable formation | Scott Lee Wellington, Steven Dexter Crane, Eric Pierre de Rouffignac, John Michael Karanikas, Kevin Albert Maher +3 more | 2006-01-03 |
| 6948562 | Production of a blending agent using an in situ thermal process in a relatively permeable formation | Scott Lee Wellington, Eric Pierre de Rouffignac, John Michael Karanikas, Kevin Albert Maher, Margaret Ann Messier +2 more | 2005-09-27 |
| 4970573 | Self-planarized gold interconnect layer | Jimmy C. Black, George E. Mraz | 1990-11-13 |
| 4753851 | Multiple layer, tungsten/titanium/titanium nitride adhesion/diffusion barrier layer structure for gold-base microcircuit interconnection | Charles M. Dalton, Jimmy C. Black | 1988-06-28 |
| 4716071 | Method of ensuring adhesion of chemically vapor deposited oxide to gold integrated circuit interconnect lines | Jimmy C. Black, Dyer A. Matlock | 1987-12-29 |
| 4713260 | Method of ensuring adhesion of chemically vapor deposited oxide to gold integrated circuit interconnect lines | Jimmy C. Black, Dyer A. Matlock | 1987-12-15 |
| 4702967 | Multiple-layer, multiple-phase titanium/nitrogen adhesion/diffusion barrier layer structure for gold-base microcircuit interconnection | Jimmy C. Black | 1987-10-27 |
| 4624749 | Electrodeposition of submicrometer metallic interconnect for integrated circuits | Jimmy C. Black, Dyer A. Matlock | 1986-11-25 |