Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8286111 | Thermal simulation using adaptive 3D and hierarchical grid mechanisms | Rajit Chandra, John Yanjiang Shu, Adi Srinivasan | 2012-10-09 |
| 8019580 | Transient thermal analysis | Rajit Chandra, John Yanjiang Shu, Adi Srinivasan | 2011-09-13 |