Issued Patents All Time
Showing 76–98 of 98 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5885853 | Hollow chip package and method of manufacture | — | 1999-03-23 |
| 5838065 | Integrated thermal coupling for heat generating device | John S. Fitch | 1998-11-17 |
| 5787976 | Interleaved-fin thermal connector | John S. Fitch, Robert Alan Eustace | 1998-08-04 |
| 5776800 | Paddleless molded plastic semiconductor chip package | John S. Fitch, Yezdi Dordi | 1998-07-07 |
| 5629840 | High powered die with bus bars | John S. Fitch, Norman Paul Jouppi | 1997-05-13 |
| 5604376 | Paddleless molded plastic semiconductor chip package | John S. Fitch, Yezdi Dordi | 1997-02-18 |
| 5582242 | Thermosiphon for cooling a high power die | John S. Fitch, Norman Paul Jouppi | 1996-12-10 |
| 5445697 | Fixture and method for attaching components | John S. Fitch | 1995-08-29 |
| 5247426 | Semiconductor heat removal apparatus with non-uniform conductance | John S. Fitch | 1993-09-21 |
| 5243756 | Integrated circuit protection by liquid encapsulation | John S. Fitch | 1993-09-14 |
| 5240549 | Fixture and method for attaching components | John S. Fitch | 1993-08-31 |
| 5235211 | Semiconductor package having wraparound metallization | — | 1993-08-10 |
| 5224263 | Gentle package extraction tool and method | — | 1993-07-06 |
| 5203401 | Wet micro-channel wafer chuck and cooling method | John S. Fitch | 1993-04-20 |
| 5198753 | Integrated circuit test fixture and method | — | 1993-03-30 |
| 5150197 | Die attach structure and method | — | 1992-09-22 |
| 5130889 | Integrated circuit protection by liquid encapsulation | John S. Fitch | 1992-07-14 |
| 5115858 | Micro-channel wafer cooling chuck | John S. Fitch | 1992-05-26 |
| 5083373 | Method for providing a thermal transfer device for the removal of heat from packaged elements | — | 1992-01-28 |
| 4995451 | Evaporator having etched fiber nucleation sites and method of fabricating same | — | 1991-02-26 |
| 4966226 | Composite graphite heat pipe apparatus and method | — | 1990-10-30 |
| 4839774 | Apparatus and method for cooling electronic component packages using an array of directed nozzles fabricated in the circuit board | — | 1989-06-13 |
| 4800956 | Apparatus and method for removal of heat from packaged element | — | 1989-01-31 |