Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381129 | Liner-free through-silicon-vias formed by selective metal deposition | David B. Thomas, John G. Twombly, Michael T. Brigham, Bruce W. Porth, Vivekanand Kalaparthi | 2025-08-05 |