Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211254 | Process for integrated circuit fabrication using a buffer layer as a stop for chemical mechanical polishing of a coupled dielectric oxide layer | Pradeep Basavanahalli Kumarswamy, Hong Kia Koh, Alberto Leotti, Patrice Ramonda | 2021-12-28 |
| 9997393 | Methods for fabricating integrated circuits including substrate contacts | Bo Yu, Zeng Wang, Wensheng Deng, Purakh Raj Verma | 2018-06-12 |