Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8860185 | Crack-arresting structure for through-silicon vias | Yue Kang Lu, Yeow Kheng Lim, Juan Boon Tan | 2014-10-14 |
| 8466062 | TSV backside processing using copper damascene interconnect technology | Yue Kang Lu, Yeow Kheng Lim, Juan Boon Tan | 2013-06-18 |