Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4750666 | Method of fabricating gold bumps on IC's and power chips | James A. Loughran | 1988-06-14 |
| 4745455 | Silicon packages for power semiconductor devices | Homer H. Glascock, II, Harold F. Webster, Fadel A. Selim, David L. Mueller, Dante E. Piccone | 1988-05-17 |
| 4646129 | Hermetic power chip packages | Alexander J. Yerman | 1987-02-24 |
| 4574299 | Thyristor packaging system | Homer H. Glascock, II, Harold F. Webster | 1986-03-04 |