Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 6409473 | Low stress connection methodology for thermally incompatible materials | E-June Chen, Bjoern Schenk, Ramesh Bapat, I. Gene Fowkes, Shen-Yeh Chen +2 more | 2002-06-25 | $20,890,000 |
| 5279892 | Composite airfoil with woven insert | Jack W. Baldwin | 1994-01-18 | $18,622,000 |