KI

Kenji Isihara

FC Fukuda Metal Foil & Powder Co.: 2 patents #26 of 95Top 30%
Overall (All Time): #2,296,336 of 4,157,543Top 60%
2
Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
5356528 Copper foil for printed circuits and method of producing same Katsuhito Fukuda, Masato Takami, Hirokazu Hasegawa, Chiaki Nakajima 1994-10-18
5338619 Copper foil for printed circuits and method of producing same Katsuhito Fukuda, Masato Takami, Hirokazu Hasegawa, Chiaki Nakajima 1994-08-16