Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11208578 | Hot melt composition, hot melt composition production method, seal material, electronic device, and lamp | Hiroshi Kurokawa | 2021-12-28 |
| 10975272 | Hot melt composition, hot melt composition production method, seal material, electronic device, and lamp | Hiroshi Kurokawa | 2021-04-13 |
| 10400142 | Hot melt adhesive | Hisashi Ichikawa, Hiroshi Kurokawa, Maki Samitsu | 2019-09-03 |
| 5356528 | Copper foil for printed circuits and method of producing same | Masato Takami, Hirokazu Hasegawa, Chiaki Nakajima, Kenji Isihara | 1994-10-18 |
| 5338619 | Copper foil for printed circuits and method of producing same | Masato Takami, Hirokazu Hasegawa, Chiaki Nakajima, Kenji Isihara | 1994-08-16 |
| 4981560 | Method of surface treatment of copper foil or a copper clad laminate for internal layer | Toshiyuki Kajihara, Masato Takami | 1991-01-01 |
| 4387006 | Method of treating the surface of the copper foil used in printed wire boards | Toshiyuki Kajiwara, Yoshinori Tanii | 1983-06-07 |