Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5349219 | Wafer-scale semiconductor integrated circuit device and method of forming interconnection lines arranged between chips of wafer-scale semiconductor integrated circuit device | Toshiaki Murao, Takeo Kikuchi, Hidenori Nomura, Hiroyuki Sugamoto | 1994-09-20 |
| 5032889 | Wiring structure in a wafer-scale integrated circuit | Toshiaki Murao, Takeo Kikuchi, Hiroyuki Sugamoto, Hidenori Nomura | 1991-07-16 |