Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5349219 | Wafer-scale semiconductor integrated circuit device and method of forming interconnection lines arranged between chips of wafer-scale semiconductor integrated circuit device | Takeo Kikuchi, Toshihiko Iryu, Hidenori Nomura, Hiroyuki Sugamoto | 1994-09-20 |
| 5032889 | Wiring structure in a wafer-scale integrated circuit | Takeo Kikuchi, Toshihiko Iryu, Hiroyuki Sugamoto, Hidenori Nomura | 1991-07-16 |
| 5011547 | Aluminum alloy composite material for brazing | Hideo Fujimoto, Masakazu Hirano, Mituo Hashiura | 1991-04-30 |
| 4461348 | Heat exchanger | Hiroaki Toge, Shinichi Esaka, Yutaka Murakami | 1984-07-24 |