Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8268113 | Apparatus and method for fabricating bonded substrate | Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima | 2012-09-18 |
| 7963308 | Apparatus and method for fabricating bonded substrate | Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima | 2011-06-21 |
| 7704348 | Apparatus and method for fabricating bonded substrate | Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima | 2010-04-27 |
| 7597774 | Apparatus and method for fabricating bonded substrate | Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima | 2009-10-06 |
| 7137427 | Apparatus and method for fabricating bonded substrate | Takuya Ohno, Tsukasa Adachi, Koji Hashizume, Yosimasa Miyajima, Takao Kojima | 2006-11-21 |
| 6297131 | Semiconductor device manufacturing method for grinding and dicing a wafer from a back side of the wafer | Yutaka Yamada | 2001-10-02 |
| 5930654 | Method of producing semiconductor devices including a step of dicing a semiconductor wafer while covering the semiconductor wafer by a tape | Yoshihiro Tohyama, Akihisa Hayashida, Hidenori Akatani | 1999-07-27 |