Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5930654 | Method of producing semiconductor devices including a step of dicing a semiconductor wafer while covering the semiconductor wafer by a tape | Yoshihiro Tohyama, Takanori Muramoto, Hidenori Akatani | 1999-07-27 |
| 5286329 | Tape-on-wafer mounting apparatus and method | Nobuo Iijima | 1994-02-15 |