Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6727718 | Electronic component package, printed circuit board, and method of inspecting the printed circuit board | Yasuhiro Ichihara, Hiroshi Iimura, Fumio Arase | 2004-04-27 |
| 6498307 | Electronic component package, printing circuit board, and method of inspecting the printed circuit board | Yasuhiro Ichihara, Hiroshi Iimura, Fumio Arase | 2002-12-24 |
| 5337467 | Method of producing wire-bonded substrate assembly | Mamoru Niishiro | 1994-08-16 |
| 5182853 | Method for encapsulting IC chip | Yasushi Kobayashi | 1993-02-02 |