Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5828128 | Semiconductor device having a bump which is inspected from outside and a circuit board used with such a semiconductor device | Yutaka Higashiguchi, Toshio Kumai, Yasuhiro Teshima, Yasushi Kobayashi, Yukio Sekiya +2 more | 1998-10-27 |
| 5760469 | Semiconductor device and semiconductor device mounting board | Yutaka Higashiguchi, Mitsuo Inagaki, Toshio Kumai, Ryoichi Ochiai, Yasuhiro Teshima +7 more | 1998-06-02 |
| 5413164 | Heating furnace in combination with electronic circuit modules | Yasuhiro Teshima, Michinori Matsubayashi | 1995-05-09 |
| 5337467 | Method of producing wire-bonded substrate assembly | Seiji Kogure | 1994-08-16 |