Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7350685 | Method of mounting electronic component | Takayoshi Matsumura, Hidehiko Kira, Kenji Kobae | 2008-04-01 |
| 7347347 | Head assembly, disk unit, and bonding method and apparatus | Hidehiko Kira, Shunji Baba, Toru Okada, Takatoyo Yamakami, Yasunori Sasaki +3 more | 2008-03-25 |
| 7208059 | Method of ultrasonic-mounting electronic component and ultrasonic mounting machine | Takayoshi Matsumura, Hidehiko Kira, Kenji Kobae | 2007-04-24 |
| 7196512 | Magnetic head tester | Hidehiko Kira, Kenji Kobae, Hiroshi Kobayashi, Katsutoshi Hirasawa, Takatoyo Yamakami +2 more | 2007-03-27 |
| 6943971 | Slider tester | Hidehiko Kira, Shinji Hiraoka, Hirokazu Yamanishi, Atsushi Suzuki | 2005-09-13 |
| 6885522 | Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation | Hidehiko Kira, Shunji Baba, Toru Okada, Takatoyo Yamakami, Yasunori Sasaki +3 more | 2005-04-26 |
| 6787925 | Mounting method of semiconductor device | Kazuhisa Tsunoi, Hidehiko Kira, Shunji Baba, Akira Fujii, Toshihiro Kusagaya +3 more | 2004-09-07 |
| 6770319 | Resin coating method | Shunji Baba, Takatoyo Yamakami, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi | 2004-08-03 |
| 6716665 | Method of mounting chip onto printed circuit board in shortened working time | Shunji Baba, Takatoyo Yamakami, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi | 2004-04-06 |
| 6582993 | Method of underfilling semiconductor device | Shunji Baba, Kenji Kobae, Hidehiko Kira | 2003-06-24 |
| 6483190 | Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method | Shunji Baba, Hidehiko Kira, Toru Okada | 2002-11-19 |
| 6458237 | Mounting method of semiconductor device | Kazuhisa Tsunoi, Hidehiko Kira, Shunji Baba, Akira Fujii, Toshihiro Kusagaya +3 more | 2002-10-01 |
| 6437450 | Method of mounting semiconductor chip | Shunji Baba, Takatoyo Yamakami, Kenji Kobae, Hidehiko Kira, Hiroshi Kobayashi | 2002-08-20 |
| 6400529 | Integrated circuit chip supporting and electrically connecting a head slider | Shunji Baba, Hidehiko Kira, Toru Okada | 2002-06-04 |
| 6369985 | Head suspension, head assembly, and disk apparatus having a head IC mounted on a head suspension, and method for fitting a head IC to a head suspension | Akio Gouo, Hidehiko Kira, Takeshi Ohwe | 2002-04-09 |
| 6240634 | Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board | Hidehiko Kira, Kenji Kobae, Naoki Ishikawa, Satoshi Emoto | 2001-06-05 |
| 6122823 | Apparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board | Hidehiko Kira, Kenji Kobae, Naoki Ishikawa, Satoshi Emoto | 2000-09-26 |
| 6006426 | Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board | Hidehiko Kira, Kenji Kobae, Naoki Ishikawa, Satoshi Emoto | 1999-12-28 |
| 4629362 | Shield tunneling machine | Takashi Sakuraya, Akira Tanaka, Yoshio Yanagi | 1986-12-16 |