Issued Patents All Time
Showing 26–43 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7367108 | Method of bonding flying leads | Takashi Kubota, Kimio Nakamura | 2008-05-06 |
| 7356907 | Method of manufacturing a carriage assembly of a hard disk drive | Takashi Kubota | 2008-04-15 |
| 7355285 | Structure of mounting electronic component | Hidehiko Kira, Norio Kainuma, Takayoshi Matsumura | 2008-04-08 |
| 7350685 | Method of mounting electronic component | Takayoshi Matsumura, Hidehiko Kira, Norio Kainuma | 2008-04-01 |
| 7347347 | Head assembly, disk unit, and bonding method and apparatus | Hidehiko Kira, Shunji Baba, Norio Kainuma, Toru Okada, Takatoyo Yamakami +3 more | 2008-03-25 |
| 7208059 | Method of ultrasonic-mounting electronic component and ultrasonic mounting machine | Takayoshi Matsumura, Hidehiko Kira, Norio Kainuma | 2007-04-24 |
| 7196512 | Magnetic head tester | Norio Kainuma, Hidehiko Kira, Hiroshi Kobayashi, Katsutoshi Hirasawa, Takatoyo Yamakami +2 more | 2007-03-27 |
| 7134588 | Bonding tool for ultrasonic bonding and method of ultrasonic bonding | Takashi Kubota | 2006-11-14 |
| 6885522 | Head assembly having integrated circuit chip covered by layer which prevents foreign particle generation | Hidehiko Kira, Shunji Baba, Norio Kainuma, Toru Okada, Takatoyo Yamakami +3 more | 2005-04-26 |
| 6787925 | Mounting method of semiconductor device | Kazuhisa Tsunoi, Hidehiko Kira, Shunji Baba, Akira Fujii, Toshihiro Kusagaya +3 more | 2004-09-07 |
| 6770319 | Resin coating method | Shunji Baba, Takatoyo Yamakami, Norio Kainuma, Hidehiko Kira, Hiroshi Kobayashi | 2004-08-03 |
| 6716665 | Method of mounting chip onto printed circuit board in shortened working time | Shunji Baba, Takatoyo Yamakami, Norio Kainuma, Hidehiko Kira, Hiroshi Kobayashi | 2004-04-06 |
| 6582993 | Method of underfilling semiconductor device | Shunji Baba, Hidehiko Kira, Norio Kainuma | 2003-06-24 |
| 6458237 | Mounting method of semiconductor device | Kazuhisa Tsunoi, Hidehiko Kira, Shunji Baba, Akira Fujii, Toshihiro Kusagaya +3 more | 2002-10-01 |
| 6437450 | Method of mounting semiconductor chip | Shunji Baba, Takatoyo Yamakami, Norio Kainuma, Hidehiko Kira, Hiroshi Kobayashi | 2002-08-20 |
| 6240634 | Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board | Hidehiko Kira, Norio Kainuma, Naoki Ishikawa, Satoshi Emoto | 2001-06-05 |
| 6122823 | Apparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board | Hidehiko Kira, Norio Kainuma, Naoki Ishikawa, Satoshi Emoto | 2000-09-26 |
| 6006426 | Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board | Hidehiko Kira, Norio Kainuma, Naoki Ishikawa, Satoshi Emoto | 1999-12-28 |