Issued Patents All Time
Showing 51–64 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787925 | Mounting method of semiconductor device | Kazuhisa Tsunoi, Shunji Baba, Akira Fujii, Toshihiro Kusagaya, Kenji Kobae +3 more | 2004-09-07 |
| 6770319 | Resin coating method | Shunji Baba, Takatoyo Yamakami, Norio Kainuma, Kenji Kobae, Hiroshi Kobayashi | 2004-08-03 |
| 6716665 | Method of mounting chip onto printed circuit board in shortened working time | Shunji Baba, Takatoyo Yamakami, Norio Kainuma, Kenji Kobae, Hiroshi Kobayashi | 2004-04-06 |
| 6582993 | Method of underfilling semiconductor device | Shunji Baba, Kenji Kobae, Norio Kainuma | 2003-06-24 |
| 6483190 | Semiconductor chip element, semiconductor chip element mounting structure, semiconductor chip element mounting device and mounting method | Norio Kainuma, Shunji Baba, Toru Okada | 2002-11-19 |
| 6458237 | Mounting method of semiconductor device | Kazuhisa Tsunoi, Shunji Baba, Akira Fujii, Toshihiro Kusagaya, Kenji Kobae +3 more | 2002-10-01 |
| 6437450 | Method of mounting semiconductor chip | Shunji Baba, Takatoyo Yamakami, Norio Kainuma, Kenji Kobae, Hiroshi Kobayashi | 2002-08-20 |
| 6400529 | Integrated circuit chip supporting and electrically connecting a head slider | Shunji Baba, Norio Kainuma, Toru Okada | 2002-06-04 |
| 6369985 | Head suspension, head assembly, and disk apparatus having a head IC mounted on a head suspension, and method for fitting a head IC to a head suspension | Akio Gouo, Norio Kainuma, Takeshi Ohwe | 2002-04-09 |
| 6291269 | Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip | Kiyoshi Fukui, Kazuhisa Tsunoi, Shunji Baba | 2001-09-18 |
| 6240634 | Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board | Kenji Kobae, Norio Kainuma, Naoki Ishikawa, Satoshi Emoto | 2001-06-05 |
| 6177730 | Semiconductor bare chip, method of manufacturing semiconductor bare chip and mounting structure of semiconductor bare chip | Kiyoshi Fukui, Kazuhisa Tsunoi, Shunji Baba | 2001-01-23 |
| 6122823 | Apparatus to produce a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board | Kenji Kobae, Norio Kainuma, Naoki Ishikawa, Satoshi Emoto | 2000-09-26 |
| 6006426 | Method of producing a multichip package module in which rough-pitch and fine-pitch chips are mounted on a board | Kenji Kobae, Norio Kainuma, Naoki Ishikawa, Satoshi Emoto | 1999-12-28 |