Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10189119 | Solder alloy for die bonding | Takeshi Asagi, Hirohiko Watanabe, Masayoshi Shimoda | 2019-01-29 |
| 4571999 | Ultrasonic inspecting apparatus | Kishio Arita, Hideo Sakai, Yoshikazu Sudo, Yoshitaka Koide, Haruzi Sato +3 more | 1986-02-25 |