Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10189119 | Solder alloy for die bonding | Takeshi Asagi, Susumu Mitani, Hirohiko Watanabe | 2019-01-29 |
| 7670879 | Manufacturing method of semiconductor module including solid-liquid diffusion joining steps | Kozo Fujimoto, Hirohiko Watanabe, Kazutaka Ikemi, Keiichi Matsumura, Katsumi Taniguchi +1 more | 2010-03-02 |