Issued Patents All Time
Showing 51–75 of 86 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9494910 | Image forming apparatus comprising board holding member configured to have surface to which board is fixed | Shinobu Ohata | 2016-11-15 |
| 9461021 | Electronic circuit comprising PN junction and schottky barrier diodes | — | 2016-10-04 |
| 9454129 | Image forming apparatus composing one face of exterior cover by partly overlapping cover boards | — | 2016-09-27 |
| 9442452 | Image forming apparatus comprising connecting mechanism configured to electrically connect high-voltage board and unit | Shinobu Ohata | 2016-09-13 |
| 9434560 | Sheet feeder and image forming apparatus | Seiji Okada | 2016-09-06 |
| 9379634 | Semiconductor device | Takukazu Otsuka, Masao Saito | 2016-06-28 |
| 9245956 | Electronic circuit comprising unipolar and bipolar devices | — | 2016-01-26 |
| 9207620 | Combined units and image forming system | Terumitsu Noso | 2015-12-08 |
| 9142542 | Semiconductor device with protective diode | — | 2015-09-22 |
| 9136378 | Semiconductor device and manufacturing method for same | Mineo Miura, Katsuhisa Nagao, Shuhei Mitani | 2015-09-15 |
| 9099331 | Semiconductor device | — | 2015-08-04 |
| 8995030 | Image forming apparatus | Masayuki Kakuta | 2015-03-31 |
| 8982204 | Inspection management apparatus, system, and method, and computer readable recording medium | Takeshi Nishiyama, Isao TATESHITA, Takaharu HOSOI | 2015-03-17 |
| 8970020 | Semiconductor device | — | 2015-03-03 |
| 8971044 | Semiconductor device | Takukazu Otsuka, Masao Saito | 2015-03-03 |
| 8844921 | Sheet post-processing device, and image forming apparatus including sheet post-processing device | — | 2014-09-30 |
| 8608150 | Sheet post-processing apparatus with branched holding path | — | 2013-12-17 |
| 8592986 | High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device | Takukazu Otsuka, Brian Lynn Rowden | 2013-11-26 |
| 8513806 | Laminated high melting point soldering layer formed by TLP bonding and fabrication method for the same, and semiconductor device | Takukazu Otsuka | 2013-08-20 |
| 8208260 | Semiconductor device | Takukazu Otsuka, Masao Saito | 2012-06-26 |
| 8152159 | Sheet feeding device and image forming apparatus including a controlled elevator mechanism | — | 2012-04-10 |
| 7938396 | Sheet feeding device and image forming apparatus including sheet feeding device with a sheet feeding preparation period | Yoshio Sugishima, Yoshihiro Yamaguchi | 2011-05-10 |
| 7883084 | Sheet feeding device and image forming apparatus with warm air unit for blowing air toward upper face of sheet stack | Yoshihiro Yamaguchi, Yoshio Sugishima, Sachio Izumichi | 2011-02-08 |
| 7864533 | Semiconductor device | Takukazu Otsuka, Masao Saito | 2011-01-04 |
| 7823876 | Sheet feeding device and image forming apparatus including sheet feeding device with rear end detection portion | Yoshio Sugishima, Masahiko Miyazaki, Seiichi Shirasaki, Yasunori Ueno, Sachio Izumichi | 2010-11-02 |