Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8592986 | High melting point soldering layer alloyed by transient liquid phase and fabrication method for the same, and semiconductor device | Takukazu Otsuka, Keiji Okumura | 2013-11-26 |