Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8291368 | Method for reducing surface area of pad limited semiconductor die layout | Sumeet Aggarwal, Meng Kong Lye | 2012-10-16 |
| 8288814 | Via definition for semiconductor die | Pankaj K. Jha, Rajesh Bansal | 2012-10-16 |
| 8242613 | Bond pad for semiconductor die | Shailesh Kumar, Meng Kong Lye | 2012-08-14 |
| 7986166 | Clock buffer circuit | Nitin Verma | 2011-07-26 |