Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12119316 | Patterned and planarized under-bump metallization | Namrata Kanth, Paul Southworth, Scott M. Hayes, Dwight L. Daniels, Yufu Liu +1 more | 2024-10-15 |
| 8836092 | Semiconductor device with thermal dissipation lead frame | Chetan Verma, Piyush Kumar Mishra | 2014-09-16 |
| 8163604 | Integrated circuit package system using etched leadframe | You Yang Ong, Suhairi Mohmad | 2012-04-24 |