Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8455355 | Method for producing through-contacts in semi-conductor wafers via production of through-plated holes | Olaf Krueger, Gerd Schoene, Tim Wernicke, Joachim Wuerfl | 2013-06-04 |
| 5193739 | Process and device for soldering electronic boards, in particular, printed circuit boards with devices installed on them | Volker Liedke, Karl-Heinz Grasmann, Hans-Jurgen Albrecht, Harald Wittrich, Wolfgang Scheel | 1993-03-16 |
| 5192582 | Procedure for processing joints to be soldered | Volker Liedke, Karl-Heinz Grasmann, Hans-Jurgen Albrecht, Harald Wittrich, Wolfgang Scheel | 1993-03-09 |