Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8866191 | HEMT semiconductor component with field plates | Eldat Bahat-Treidel, Victor Sidorov | 2014-10-21 |
| 8648466 | Method for producing a metallization having two multiple alternating metallization layers for at least one contact pad and semiconductor wafer having said metallization for at least one contact pad | Victor Sidorov, Rimma Zhytnytska | 2014-02-11 |
| 8455355 | Method for producing through-contacts in semi-conductor wafers via production of through-plated holes | Olaf Krueger, Gerd Schoene, Wilfred John, Tim Wernicke | 2013-06-04 |