Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12249589 | Apparatus and method for BGA coplanarity and warpage control | Joe Hai, Zhongming Wu, Ernesto A. Opiniano | 2025-03-11 |
| 9329227 | Method and apparatus for testing interconnection reliability of a ball grid array on a testing printed circuit board | Min-Jae Woo | 2016-05-03 |
| 9283698 | System and method for preventing warpage of metal components during manufacturing processes | Shouzhong (Alex) Du, Richard Dale Michonski, Jichen (Jeff) Qin | 2016-03-15 |
| 8534136 | Pin soldering for printed circuit board failure testing | Miao Cai, Boyi WU | 2013-09-17 |