Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7141269 | Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer | Don-Gey Liu, Tsong-Jen Yang, Chin-Hao Yang, Hong-Yuan Hsu, Giin-Shan Chen | 2006-11-28 |
| 6838116 | Oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition | Don-Gey Liu, Tsong-Jen Yang, Chin-Hao Yang, Giin-Shan Chen | 2005-01-04 |