Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7141269 | Molding technique for copper interconnecting wires by electrochemical displacement deposition on the pre-shaped metal layer | Don-Gey Liu, Tsong-Jen Yang, Chin-Hao Yang, Wen Yang, Giin-Shan Chen | 2006-11-28 |