PL

Ping Li

EC Epicmems(Xiamen) Co.: 6 patents #1 of 7Top 15%
SS Skyworks Solutions: 5 patents #290 of 948Top 35%
SC Smarter Microelectronics (Guang Zhou) Co.: 3 patents #5 of 27Top 20%
LS Lsi: 2 patents #602 of 1,740Top 35%
TS Triquint Semiconductor: 2 patents #53 of 243Top 25%
SU Southwest Petroleum University: 1 patents #417 of 1,158Top 40%
JU Jiangnan University: 1 patents #442 of 1,321Top 35%
Lsi Logic: 1 patents #1,146 of 1,957Top 60%
IC Intradin (Huzhou) Precision Technology Co.: 1 patents #9 of 11Top 85%
📍 Lo Wu, MA: #18 of 77 inventorsTop 25%
Overall (All Time): #84,116 of 4,157,543Top 3%
38
Patents All Time

Issued Patents All Time

Showing 26–38 of 38 patents

Patent #TitleCo-InventorsDate
9667203 Apparatus and methods power amplifier biasing Paul T. DiCarlo 2017-05-30
9346109 Unequal helix-angle end mill Jin Xu, Shuzhang Fang, Shequan Wang 2016-05-24
9324855 Lateral power device having low specific on-resistance and using high-dielectric constant socket structure and manufacturing method therefor Junhong Li 2016-04-26
9136803 Apparatus and methods for biasing a power amplifier Paul T. DiCarlo 2015-09-15
8733176 MEMS stress concentrating structure for MEMS sensors 2014-05-27
8717101 Apparatus and methods for biasing power amplifiers Paul T. DiCarlo 2014-05-06
7612614 Device and method for biasing a transistor amplifier Cong Li, Wei Wang 2009-11-03
7532074 Device and method for biasing a transistor amplifier Chi Lap Yuen, Chun Tak Chow 2009-05-12
7413984 Multi-step process for forming a barrier film for use in copper layer formation Wilbur G. Catabay, Zhihai Wang 2008-08-19
7229923 Multi-step process for forming a barrier film for use in copper layer formation Wilbur G. Catabay, Zhihai Wang 2007-06-12
7010284 Wireless communications device including power detector circuit coupled to sample signal at interior node of amplifier Li Liu, Christopher C. Souchuns, Gregory Henderson 2006-03-07
6989712 Accurate power detection for a multi-stage amplifier Li Liu, Christopher C. Souchuns, Gregory Henderson 2006-01-24
6727177 Multi-step process for forming a barrier film for use in copper layer formation Wilbur G. Catabay, Zhihai Wang 2004-04-27