Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8889483 | Method of manufacturing semiconductor device including filling gap between substrates with mold resin | — | 2014-11-18 |
| 8461690 | Semiconductor device capable of suppressing generation of cracks in semiconductor chip during manufacturing process | Masanori Yoshida, Daisuke Tsuji, Jun Sasaki, Kaoru Sonobe, Akira Ide +1 more | 2013-06-11 |