Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8461690 | Semiconductor device capable of suppressing generation of cracks in semiconductor chip during manufacturing process | Masanori Yoshida, Daisuke Tsuji, Masahito Yamato, Jun Sasaki, Akira Ide +1 more | 2013-06-11 | $4,425,000 |
| 8253258 | Semiconductor device with hollow and throughhole and method of manufacturing same | Hidehiro Takeshima, Shinei Sato | 2012-08-28 | $3,290,000 |
| 5393705 | Molded semiconductor device using intermediate lead pattern on film carrier formed from lattice pattern commonly available for devices and process of fabrication thereof | — | 1995-02-28 | $16,000 |
| 5193053 | Plastic packaged semiconductor device | — | 1993-03-09 | $26,000 |