Issued Patents All Time
Showing 76–100 of 115 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835682 | High thermal expansion glass and tape composition | Yong Cho | 2004-12-28 |
| 6827800 | Process for the constrained sintering of asymmetrically configured dielectric layers | Carl B. Wang, Christopher Needes | 2004-12-07 |
| 6776861 | Tape composition and process for internally constrained sintering of low temperature co-fired ceramic | Carl B. Wang, Christopher Needes | 2004-08-17 |
| 5468695 | Lead-free thick film paste composition | Alan F. Carroll | 1995-11-21 |
| RE34982 | Thick film copper via fill inks | Ashok N. Prabhu | 1995-06-27 |
| 5393465 | Light-absorbing dielectric compositions | Lorri Drozdyk, Roger Harquail French, Arvind Halliyal | 1995-02-28 |
| 5378408 | Lead-free thick film paste composition | Alan F. Carroll | 1995-01-03 |
| 5210057 | Partially crystallizable glass compositions | Michael J. Haun, Arvind Halliyal | 1993-05-11 |
| 5137848 | Dielectric composition containing kerf additive | Michael F. Barker, William A. Craig, Paul C. Donohue, Michael J. Haun, Colin R. Pickering | 1992-08-11 |
| 5082804 | Thick film copper via fill inks | Ashok N. Prabhu | 1992-01-21 |
| 4997795 | Dielectric compositions of devitrified glass containing small amounts of lead oxide and iron oxide | Ashok N. Prabhu, Wayne M. Anderson | 1991-03-05 |
| 4959330 | Crystallizable glass and thick film compositions thereof | Paul C. Donohue, Michael J. Haun | 1990-09-25 |
| 4880567 | Thick film copper conductor inks | Ashok N. Prabhu, Edward J. Conlon | 1989-11-14 |
| 4874550 | Thick-film copper conductor inks | Ashok N. Prabhu, Edward J. Conlon | 1989-10-17 |
| 4863517 | Via fill ink composition for integrated circuits | Ashok N. Prabhu | 1989-09-05 |
| 4856670 | Low temperature processing transfer printing ink | Wayne M. Anderson | 1989-08-15 |
| 4830988 | Dielectric inks for multilayer copper circuits | Ashok N. Prabhu, Wayne M. Anderson | 1989-05-16 |
| 4816615 | Thick film copper conductor inks | Ashok N. Prabhu, Edward J. Conlon | 1989-03-28 |
| 4810420 | Thick film copper via-fill inks | Ashok N. Prabhu, Simon M. Boardman | 1989-03-07 |
| 4808673 | Dielectric inks for multilayer copper circuits | Ashok N. Prabhu, Wayne M. Anderson | 1989-02-28 |
| 4808770 | Thick-film copper conductor inks | Ashok N. Prabhu, Edward J. Conlon | 1989-02-28 |
| 4788163 | Devitrifying glass frits | Ashok N. Prabhu | 1988-11-29 |
| 4772574 | Ceramic filled glass dielectrics | Ashok N. Prabhu | 1988-09-20 |
| 4733018 | Thick film copper conductor inks | Ashok N. Prabhu, Edward J. Conlon | 1988-03-22 |
| 4467009 | Indium oxide resistor inks | Ashok N. Prabhu | 1984-08-21 |